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Wafer Back & Front Wheels

Min. Order: 500

Product Description

Trademark: SAIL HS Code: 6804221000 Origin: Suzhou We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.

The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision Diamond Wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.

Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.

Contact us if you need more details on Diamond Blades. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Dicing Blades、Dicing Saws. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Dicing Blades

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